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| the contents of this document are subject to change without notice. customers are advised to consult with fuji tsu sales representatives before ordering. fujitsu is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. fujitsu semiconductor data sheet plastic ball grid array package 320 pin plastic 320-pin plastic pbga lead pitch 1.27 mm package width package length 27.00 mm 27.00 mm lead shape ball sealing method plastic mold mounting height 2.46 mm max weight 2.90 g 320-pin plastic pbga (BGA-320P-M06) (BGA-320P-M06) 2006 fujitsu limited bga320006s-c-2-1 24.00 0.10(.945 .004) 27.00(1.063) 27.00 24.00 0.10 (1.063) (.945 .004) 0.20(.008) (4x) 1.27 1.44 (.057) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 16 17 18 20 1.44 (.057) b a ba c d e f g h j k l m n p r t u v w y c 0.15(.006) c index c 19 15 0.635 (.025) (.050) (.025) 0.635 1.27 (.050) ? 0.75 0.15(.030 .006) b m ? 0.30(.012) ? 0.15(.006) m c c a 24.13(.950) 24.13 (.950) max. 2.46(.097) min. 0.35(.014) (.065 .004) 1.66 0.10 dimensions in mm (inches). note: the values in parentheses are reference values. BGA-320P-M06 0612
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